The 2025 Third Data Centre & AI Server Liquid Cooling Technology Summit commenced today in Suzhou. This summit focuses on core topics including innovative trends in AI liquid cooling thermal management, cold plate and immersion cooling technologies, key component development, and thermal management for low-altitude unmanned aerial vehicles. It brings together innovative forces across the industry chain to collectively address the challenges of high-computing-power thermal management.
Notably, during the summit, Beisit was honoured with the ‘Yunfan Cup 2025 Data Centre Best Liquid Cooling Connector Supplier Award’ for its outstanding product performance and technological innovation capabilities, underscoring its leading position in the field of critical liquid cooling components. We cordially invite industry peers to join us at this prestigious event to explore future developments and collaboration opportunities in liquid cooling technology.
Highlights from the Exhibition
Beisit, as the Annual Partner and Principal Sponsor, has provided wholehearted collaborative support for the 2025 Third Data Centre & AI Server Liquid Cooling Technology Summit. Building upon the solid foundation of numerous successful collaborations in the field of fluid-based liquid cooling, the summit has generated unprecedented enthusiasm on-site!
The exhibition stand drew a substantial crowd of industry clients who paused to engage in discussions, creating a vibrant atmosphere of interaction with a steady stream of enquiries and negotiations. At this summit, Beisit fully demonstrated its exceptional product performance and technological innovation capabilities, while also establishing a robust platform for in-depth exchanges with partners from across the globe. Looking ahead, we look forward to collaborating with all parties to jointly advance innovation and progress within the industry.
Post time: Sep-05-2025
