On 8 October, the Marina Bay Sands Convention Centre in Singapore bustled with activity as the 2025 Asia Data Centre Exhibition (DCWA) officially commenced. Beisit showcased its latest technological achievements and industry application practices through multiple OCP (Open Compute Project)-certified fluid connector products and solutions, joining industry peers in exploring new opportunities within digital infrastructure.
Highlights from the Exhibition
Among the numerous exhibition stands, the Beisit booth consistently maintained high footfall, with a steady stream of professionals seeking information, making it one of the most talked-about exhibits at this year's fair.
Exhibited products
Manifold (Flow Distribution/Collection Module):
Constructed with a stainless steel body and high-performance sealing materials, delivering exceptional pressure resistance;
Supports multi-channel parallel flow distribution with uniform and stable flow allocation;
Modular design compatible with multiple series of quick-connect fittings;
Typical applications: cabinet-level liquid cooling distribution, multi-GPU server cluster cooling.
Inlet/Return Hoses:
Multi-layer reinforced construction delivering exceptional pressure resistance;
Wide temperature range compatibility with outstanding long-term ageing resistance;
Compliant with international industry standards, offering assured long-term quality;
Typical applications: Coolant transfer between cabinet rooms, equipment-level heat exchanger connections.
Quick Connectors Series:
UQD/UQDB Series: Effortless operation, simple insertion and removal, superior sealing performance;
BMQC Series: Blind-mate design with high tolerance capability, supports hot-swapping;
LQC Series: Compact and lightweight design for space-constrained environments; employs a threaded locking mechanism enabling effortless connection and disconnection even under operational pressure; simple operation with assured safety and reliability;
The entire range complies with OCP open standards and undergoes rigorous insertion/extraction endurance testing to meet long-term data centre operational requirements.
Blind-plug combination panel:
Features multiple blind-plug interfaces with excellent misalignment tolerance;
Delivers precise flow distribution, supporting high-flow applications;
Typical applications: Full-rack liquid cooling systems, high-density computing nodes.
Post time: Oct-10-2025
