CIIF 2026 Shanghai has entered its third day, and traffic remains high at the BEISIT booth. BEISIT showcases its complete portfolio of liquid cooling connectors this year. Focusing on liquid cooling thermal management applications, the company delivers highly reliable connection solutions ranging from core components to system integration, bringing new momentum to data centers, AI computing, energy storage and other industries.
Day 3 of the Exhibition: Explore Liquid Cooling Connections in One Stop
On the third day of the Industrial Fair, active discussions continue at the BEISIT booth. Our liquid cooling connectors and full-scenario integrated liquid cooling solutions are on full display, covering the complete system from single-point connections to system integration, addressing real pain points in liquid cooling thermal management.
Metal Liquid Cooling Connectors
Reliable Choice for Demanding Liquid Cooling Scenarios The product range includes multiple series such as UQD, UQDB, BMQC, LQC, MQD, MQDB, PBMC and TPP, complying with OCP and relevant industry standards. Featuring multi-sealing structures, the connectors deliver leak-free mating/unmating, easy cleaning and protection against medium contamination. They support blind mating and radial misalignment compensation, with low flow resistance, excellent vibration resistance and long mating cycles. Compatible with water-soluble media including propylene glycol (PG25) and ethylene glycol. Widely deployed in liquid cooling applications for data centers, AI computing, high-performance computing (HPC), solid-state transformers (SST), rail transit and more.
Non-metallic Liquid Cooling Connectors
Combining Lightweight Design and High Reliability Built with an integrated structure, built-in sealing rings and double-layer sealing design, these connectors eliminate leakage risks at multiple connection points and prevent seal ring scratching and contamination, ensuring zero leakage throughout connection and disconnection with stable reliability over the full product lifecycle. Manufactured via precision high-speed injection molding for cost-effective mass production. They support pressured mating at 0.3 MPa, low flow resistance and lightweight one-handed operation. With fully independent intellectual property rights, they are compatible with coolant, water-glycol mixtures, immersion coolants and other media. Suitable for energy storage (battery PACK, PCS), solid-state transformers (SST), high-power charging piles, high-power power supplies, high-voltage inverters and other applications.
Interlock Ball Valves
Dual Protection for Safe and Controllable Operation Adopting double-layer sealing, bidirectional actuation and dual protection against misoperation and accidental disconnection with bidirectional shutoff function. The fluid path is made of 316L stainless steel, offering full flow passage and low flow resistance while supporting pressured mating. Equipped with red/blue anti-misalignment markers and 360° rotatable tail fittings. Applied in liquid cooling scenarios such as data centers, AI computing and high-performance computing, with fully independent intellectual property rights.
Full-scenario Integrated Liquid Cooling Solutions
One-stop Resolution of Liquid Cooling Thermal Management Pain Points Services cover overall solution design, system simulation, manufacturing and full project delivery. We supply a complete product ecosystem including secondary-side piping, filtration systems, ball valves, cabinets and manifolds, with self-controlled core components. Unified product standards help resolve common challenges such as inconsistent interfaces, difficult piping matching and low efficiency in multi-supplier collaboration. Customization of bore sizes, interfaces and working media is available. Featuring low flow resistance, precise flow control, zero leakage and easy maintenance, our integrated liquid cooling solutions serve high-density heat dissipation scenarios.
On the third day of CIIF, BEISIT sincerely invites you to visit Booth 5.1H-E105. Experience the performance of our fluid connectors on site and engage in in-depth discussions on liquid cooling thermal management solutions. We look forward to exploring new possibilities in liquid cooling connectivity together!
Post time: Oct-15-2026